Flexible connector

ABSTRACT

A flexible connector includes a unitary connector block having first and second board-facing areas. The first and second board-facing areas are longitudinally spaced from each other on a chosen surface of the connector block. The connector block includes a block body transversely separating the chosen surface from an opposing surface oppositely facing from the chosen surface. The connector block includes a flexible connector bridge longitudinally interposed between the first and second board-facing areas. A first connector port is located within the first board-facing area. A second connector port is located within the second board-facing area. A connector trace extends through at least a portion of the block body between the first and second board-facing areas. The connector trace electrically connects the first and second connector ports. Methods of making and using the flexible connector are also included.

GOVERNMENT SUPPORT

This invention was made with Government support under Contract No.30059269. The Government has certain rights in this invention.

TECHNICAL FIELD

This disclosure relates to an apparatus and method for use of a flexibleconnector and, more particularly, to an apparatus and method forelectrically connecting pairs of pads on mutually angularly arrangedcircuit boards.

BACKGROUND

Sophisticated integrated systems may use a combination of electroniccomponent configurations to achieve desired packaging size/shape goals.For example, two circuit boards could be linked at an angle to oneanother (other than 180°) to fit in a desired use environment. Thesemutually-angled circuit boards need to be electrically connectedtogether. Currently, commercial angle connectors are only capable of 90°connections between circuit boards, for several hundred I/O connectionson a 0.5-0.75 mm pitch spacing.

SUMMARY

In an embodiment, a flexible connector is described.

A unitary connector block has first and second board-facing areas. Thefirst and second board-facing areas are longitudinally spaced from eachother on a chosen surface of the connector block. The connector blockincludes a block body transversely separating the chosen surface from anopposing surface oppositely facing from the chosen surface. Theconnector block includes a flexible connector bridge longitudinallyinterposed between the first and second board-facing areas. A firstconnector port is located within the first board-facing area. A secondconnector port is located within the second board-facing area. Aconnector trace extends through at least a portion of the block bodybetween the first and second board-facing areas. The connector traceelectrically connects the first and second connector ports.

In an embodiment, a method is provided. A planar chosen substrate hastransversely spaced top and bottom chosen substrate surfaces. First andsecond board-facing areas longitudinally spaced from each other aredefined on a selected one of the top and bottom chosen substratesurfaces. A planar opposing substrate has transversely spaced top andbottom opposing substrate surfaces. The chosen and opposing substratesare attached together to at least partially form a unitary connectorblock including a block body with the first and second board-facingareas on an outward-facing surface thereof. A conductive material isdeposited to generate a first connector port located within the firstboard-facing area. A conductive material is deposited to generate asecond connector port located within the second board-facing area. Aconductive material is deposited on at least one of the chosen andopposing substrate surfaces to generate a connector trace extendingthrough at least a portion of the block body between the first andsecond board-facing areas. The first and second connector ports areelectrically connected with the connector trace. A thickness of one ofthe chosen and opposing substrate surfaces is selectively reduced todefine a flexible connector bridge longitudinally interposed between thefirst and second board-facing areas. Relative angular motion of thefirst and second board-facing areas is facilitated with the connectorbridge.

In an embodiment, an apparatus is provided for electrically connectingpairs of pads on mutually angularly arranged circuit boards. A planarchosen substrate has transversely spaced top and bottom chosen substratesurfaces. First and second board-facing areas are longitudinally spacedfrom each other on a selected one of the top and bottom chosen substratesurfaces. A planar opposing substrate has transversely spaced top andbottom opposing substrate surfaces. A selected one of the chosen andopposing substrates has a significantly varied transverse thicknessalong a longitudinal dimension thereof. A unitary connector block is atleast partially formed by the chosen and opposing substrates. Theconnector block includes a block body. A first connector port is locatedwithin the first board-facing area. A second connector port is locatedwithin the second board-facing area. A connector trace extends throughat least a portion of the block body between the first and secondboard-facing areas. The connector trace electrically connects the firstand second connector ports. A flexible connector bridge islongitudinally interposed between the first and second board-facingareas for facilitating relative angular motion of the first and secondboard-facing areas.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding, reference may be made to the accompanyingdrawings, in which:

FIG. 1 is a schematic front view of one aspect of the invention;

FIG. 2 is a schematic front view of the aspect of FIG. 1 in an exampleuse environment;

FIG. 3 is a schematic front view of an alternate configuration of theaspect of FIG. 1;

FIG. 4 is a schematic front view of the configuration of FIG. 3 in anexample use environment;

FIGS. 5A-5F schematically depict an example sequence of manufacture ofthe aspect of FIGS. 1 and 3;

FIG. 6 is a schematic plan view of the aspect of FIG. 1;

FIGS. 7A-7B are schematic side views of the aspect of FIG. 1 havingdifferent example configurations;

FIG. 8 is a perspective top view of the aspect of FIG. 1 in the exampleconfiguration of FIG. 7A; and

FIGS. 9A-9C schematically depict an example sequence of installation ofthe aspect of FIG. 1.

DESCRIPTION OF ASPECTS OF THE DISCLOSURE

As used herein, the singular forms “a,” “an” and “the” can include theplural forms as well, unless the context clearly indicates otherwise. Itwill be further understood that the terms “comprises” and/or“comprising,” as used herein, can specify the presence of statedfeatures, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features, steps,operations, elements, components, and/or groups thereof.

As used herein, the term “and/or” can include any and all combinationsof one or more of the associated listed items.

As used herein, phrases such as “between X and Y” and “between about Xand Y” can be interpreted to include X and Y.

As used herein, phrases such as “between about X and Y” can mean“between about X and about Y.”

As used herein, phrases such as “from about X to Y” can mean “from aboutX to about Y.”

It will be understood that when an element is referred to as being “on,”“attached” to, “connected” to, “coupled” with, “contacting,” etc.,another element, it can be directly on, attached to, connected to,coupled with or contacting the other element or intervening elements mayalso be present. In contrast, when an element is referred to as being,for example, “directly on,” “directly attached” to, “directly connected”to, “directly coupled” with or “directly contacting” another element,there are no intervening elements present. It will also be appreciatedby those of skill in the art that references to a structure or featurethat is disposed “directly adjacent” another feature may have portionsthat overlap or underlie the adjacent feature, whereas a structure orfeature that is disposed “adjacent” another feature might not haveportions that overlap or underlie the adjacent feature.

Spatially relative terms, such as “under,” “below,” “lower,” “over,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms can encompass different orientations of adevice in use or operation, in addition to the orientation depicted inthe figures. For example, if a device in the figures is inverted,elements described as “under” or “beneath” other elements or featureswould then be oriented “over” the other elements or features.

It will be understood that, although the terms “first,” “second,” etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. Thus, a “first” element discussed below couldalso be termed a “second” element without departing from the teachingsof the present disclosure. The sequence of operations (or steps) is notlimited to the order presented in the claims or figures unlessspecifically indicated otherwise.

This technology comprises, consists of, or consists essentially of thefollowing features, in any combination.

FIG. 1 depicts an apparatus, shown here as a flexible connector 100,which could be a flexible circuit board connector, which can be used toelectrically connect pairs of pads on mutually angularly arrangedelectronic components, as will be described in greater detail withcircuit boards as an example in FIG. 2. It will be understood that theconnector technology described herein using a circuit board useenvironment is applicable to any other connector use environments, suchas connecting other electronic components The flexible connector 100 canallow for stripline, coplanar waveguide, and/or microstrip routing, andhas a high density of interconnects, which may be sufficient to providehundreds to thousands of I/O connections on a 100-200 micrometer pitch.

As shown in FIG. 1, a unitary connector block 102 has first and secondboard-facing areas, shown generally at 104 and 106, respectively. (Theterm “board-facing” is used here, for clarity of description, in thecontext of the circuit board example use environment, but it iscontemplated that a “board” need not be present for another useenvironment of the flexible connector 100.) The first and secondboard-facing areas 104 and 106 are longitudinally spaced from each otheron a chosen surface (the lower side, in the orientation andconfiguration of FIG. 1) of the connector block 102. The “longitudinal”direction, as referenced herein, is substantially horizontal in theorientation of FIG. 1, and is represented by arrow “L”. The connectorblock 102 includes a block body 108 transversely separating the chosensurface from an opposing surface (the upper side, in the orientation andconfiguration of FIG. 1) oppositely facing from the chosen surface. The“transverse” direction, as referenced herein, is perpendicular to thelongitudinal direction—thus, substantially vertical in the orientationof FIG. 1—and is represented by arrow “T”.

The connector block 102 includes a flexible connector bridge 110longitudinally interposed between the first and second board-facingareas 104 and 106. The connector bridge 110 and the first and secondboard-facing areas 104 and 106 may all be made from the same material.For example, the connector block 102 could at least partially be made ofa silicon wafer that has been processed, as will be described below orin any other suitable manner, to generate the connector bridge 110 as areduced-thickness (including zero-thickness) portion, and the first andsecond board-facing areas 104 and 106 as a full-thickness portion, ofthe same original block of raw material. Stated differently, theconnector bridge 110 and the first and second board-facing areas 104 and106 may be concurrently and unitarily formed as a monolithic componentof the connector block 102 (i.e., not intended for disassemblypost-manufacture). The connector block 102 may have a first transversethickness (t1) at the first and/or second board-facing areas 104 and106, and a second transverse thickness (t2) at the connector bridge 110.The second transverse thickness t2 may be a minority (less than half asmuch), which may be a superminority (less than one third as much), ofthe first transverse thickness t1. For example, the first transversethickness t1 could be in the range of 600-700 microns, such as in therange of 640-660 microns, while the second transverse thickness t2 couldbe in the range of 5-25 microns, such as in the range of 10-20 microns.(For example, silicon is sufficiently flexible across a thickness of5-25 microns to permit bending through a range of angles as disclosedherein.) However, it is also contemplated that the first and secondtransverse thicknesses t1 and t2 could be substantially similar, for aparticular use environment.

A selected one of the chosen surface and the opposing surface of theconnector block 102 may be contoured at differing distances from theother one of the chosen surface and the opposing surface along alongitudinal dimension of the connector block 102, as shown. Forexample, as shown in the arrangement of FIG. 1, the opposing (top)surface of the connector block 102, when ready for use, may have a“stepped” profile (shown generally at P) which varies the distance ofthe opposing surface from the chosen (bottom) surface in a linearfashion. It is contemplated, though, that the profile of the selectedone of the chosen surface and the opposing surface of the connectorblock 102 may vary in a curved, curvilinear, linear, or any desiredfashion (e.g., at least partially sloped or curved), and that theprofile could also or instead vary in any desired fashion (e.g.,gradually or in a stepwise fashion) in a lateral (i.e., into and out ofthe plane of the page of FIG. 1) direction, to provide a flexibleconnector 100 having desired properties for a particular useenvironment. For example, there could be a “spike” or other protrusionin the longitudinal direction along profile P for any desired reason,including, but not limited to, use as a reinforcement or handling aid.

The flexible connector 100 includes a first connector port 112 locatedwithin the first board-facing area 104. A second connector port 114 islocated within the second board-facing area 106. A connector trace 116(two labeled, in FIG. 1) extends through at least a portion of the blockbody 108 between the first and second board-facing areas 104 and 106.The connector trace 116 electrically connects the first and secondconnector ports 112 and 114.

As shown in FIG. 2, the chosen surface (in this Figure, the bottomsurface, using the orientation of FIG. 1) of the flexible connector 100faces first and second circuit boards 218 and 220, respectively forcreating an electrical connection therebetween. The block body 108 isinterposed between the chosen surface and the opposing surface. Theflexible connector bridge 110, which is formed by a portion of the blockbody 108, is longitudinally interposed between the first and secondboard-facing areas 104 and 106 for facilitating relative angular motionof the first and second board-facing areas 104 and 106. In this manner,the flexible connector 100 can bend and flex to electrically connectpairs of pads 222 on mutually angularly arranged first and secondcircuit boards 218 and 220. The first and second circuit boards 218 and220 are arranged relative to each other at an operative angle α. Theoperative angle α may be any desired angle which can be physicallyachieved by a predetermined configuration of the flexible connector 100.For example, and as shown in FIG. 2, the operative angle α isapproximately 90°, or an orthogonal, “right” angle. One of ordinaryskill in the art will be able to provide a flexible connector 100 havingsuitable dimensions (relative and absolute) and flexibility for spanninga desired operative angle α between first and second circuit boards 218and 220.

Turning back to FIG. 1, the block body 108 may include a plurality oflaminated substrate layers. For example, and as shown in FIG. 1, theblock body 108 could include a portion (S) made of silicon, laminatedwith one or more layers of dielectric material (D), such as polymer,and/or metal (M). When multiple layers of metal are provided, each layerof metal could include a different level of conductive traces, asdesired.

Any flexible connector 100, according to any aspect of the presentinvention, can be configured as including, as shown in FIG. 1, a planarchosen substrate (124, as shown in FIG. 1) having transversely spacedtop and bottom chosen substrate surfaces 126 and 128, respectively, andfirst and second board-facing areas 104 and 106 being longitudinallyspaced from each other on a selected one (here, bottom chosen substratesurface 128) of the top and bottom chosen substrate surfaces 126 and128. A planar opposing substrate (130, as shown in FIG. 1) hastransversely spaced top and bottom opposing substrate surfaces 132 and134, respectively. A selected one (here, opposing substrate 130) of thechosen and opposing substrates 124 and 130 has a significantly variedtransverse thickness along a longitudinal dimension thereof. A unitaryconnector block 102 is at least partially formed by the chosen andopposing substrates. The connector block 102 includes a block body 108.A first connector port 112 is located within the first board-facing area104. A second connector port 114 is located within the secondboard-facing area 106. A connector trace 116 may extend through at leasta portion of the block body 108 between the first and secondboard-facing areas 104 and 106. The connector trace 116 electricallyconnects the first and second connector ports 112 and 114. A flexibleconnector bridge 110 may be longitudinally interposed between the firstand second board-facing areas 104 and 106 for facilitating relativeangular motion of the first and second board-facing areas 104 and 106.This general description applies to any embodiment of the aspects of theinvention shown and described herein. However, it should be noted thatthe substrate definitions and descriptions earlier in this paragraphapply to the configuration of the flexible connector 100 shown in FIGS.1-2, where the connector bridge 110 is positioned on the connector block102 toward the “interior” side of operative angle α.

In the configuration of the flexible connector 100 shown in FIGS. 3-4,in contrast to that of FIGS. 1-2, the connector bridge 110 is positionedon the connector block 102 toward the “exterior” side of operative angleα. Therefore, the identification of the “chosen” substrate 124 and“opposing” substrate 130, and the “top” and “bottom” as shown, arereversed for the configuration shown in FIGS. 3-4, as compared to theconfiguration of FIGS. 1-2. One of ordinary skill in the art willunderstand the manner in which the orientation and definitions can beadjusted to accurately reference each of these two configurations.

In the configuration of FIGS. 3-4, the block body 108 includes at leastone increased-thickness portion and at least one reduced-thicknessportion, as with the previously described configuration of FIGS. 1-2.However, in the configuration of FIGS. 3-4, the selected substrate layer124 or 130 forming the chosen surface has a significantly variedtransverse thickness along a longitudinal dimension thereof.Accordingly, each connector trace 116 of this configuration includes atleast one via 436 extending transversely through an increased-thicknessportion of the block body. In this manner, the material of the chosensubstrate 124 can have the previously described varying profile P whilealso including the first and second board-facing areas 104 and 106. Oneof ordinary skill in the art will understand how to design andmanufacture the configuration of the flexible connector 100 shown inFIGS. 3-4. Therefore, the remainder of this description, and FIGS.5A-9C, will use the configuration of FIGS. 1-2 as an example, withoutexcluding or prejudicing a corresponding characterization of thedescribed and shown features and actions which uses the configuration ofFIGS. 3-4.

Turning to FIGS. 5A-5F, an example sequence of manufacture for theflexible connector 100 is shown. In FIG. 5A, a base block, characterizedhere as a silicon (or silicon on insulator) wafer or block “S” isprovided. For the sake of description, this block “S” is being describedas a planar opposing substrate 130 having transversely spaced top andbottom opposing substrate surfaces 132 and 134. (It should be noted thatthe “build” of FIGS. 5A-5F is depicted as being “upside down” from thecorresponding finished flexible connector 100 shown in FIG. 1.) A planarchosen substrate 124 has transversely spaced top and bottom chosensubstrate surfaces 126 and 128, which is depicted in FIG. 5B asincluding alternating layers of dielectric “D” and metal “M” laminatedstructures, which could be considered to be a “multi-level metallizationlayer” construct. First and second board-facing areas 104 and 106longitudinally spaced from each other are defined on a selected one ofthe top and bottom chosen substrate surfaces—here, on the bottom chosensubstrate surface 128. As shown also in FIG. 5B, the chosen and opposingsubstrates 124 and 130 are attached together to at least partially forma unitary connector block 102 including a block body 108 with the firstand second board-facing areas 104 and 106 on an outward-facing surfacethereof.

Turning to FIG. 5C, a conductive material is deposited to generate atleast one first connector port 112 located within the first board-facingarea 104. Similarly, a conductive material is deposited to generate atleast one second connector port 114 located within the secondboard-facing area 106. The first and second connector ports 112 and 114are shown and described herein as being “bump bonds”. It is alsocontemplated that the first and second connector ports 112 and 114 couldinstead or also include press contact type interfaces, but it may bedesirable to include some sort of holdaway structures in the flexibleconnector 100 for press contact interfaces.

A conductive material is deposited on at least one of the chosen andopposing substrate surfaces to generate a connector trace 116 extendingthrough at least a portion of the block body 108 between the first andsecond board-facing areas 104 and 106. This could occur, for example, inany of FIGS. 5B-5F. The first and second connector ports 112 and 114 areelectrically connected with the connector trace 116. (As an aside, itshould be noted, for the configuration of the flexible connector 100shown in FIGS. 3-4, depositing a conductive material on at least one ofthe chosen and opposing substrate surfaces to generate a connector trace116 may include creating at least one via 436 extending transverselythrough an increased-thickness portion of the block body 108.)

Optionally, starting in FIG. 5C, a “handle wafer” (not shown) could beremovably attached to the chosen substrate surface to facilitatehandling of the flexible connector 100 during manufacture without undulystressing fragile portions of the structure.

In FIG. 5D, a thickness of the opposing substrate 130 is optionallyreduced across an entire longitudinal dimension thereof, in any desiredmanner, particularly if the initial silicon S block provided is thickerthan desired for the final flexible connector 100.

Then, in FIG. 5E, a thickness of one of the chosen and opposingsubstrate surfaces, depending on the configuration (here, the topopposing substrate surface 132) is selectively reduced, to define aflexible connector bridge 110 longitudinally interposed between thefirst and second board-facing areas 104 and 106. Optionally, and againdepending on the configuration of the flexible connector 100,selectively reducing a thickness of one of the chosen and opposingsubstrate surfaces to define the flexible connector bridge 110 (e.g., tothickness t2) may include selectively reducing a thickness of theselected one of the chosen and opposing substrate surfaces upon whichthe first and second board-facing areas 104 and 106 are defined.Alternately, and once again depending on the configuration of theflexible connector 100, selectively reducing a thickness of one of thechosen and opposing substrate surfaces to define the flexible connectorbridge 110 (e.g., to thickness t2) may include selectively reducing athickness of the other one of the chosen and opposing substrate surfacesupon which the first and second board-facing areas 104 and 106 aredefined. One of ordinary skill in the art will be able to create asuitable manufacturing process, using standard silicon foundry processesor any other desired processes or techniques, to manufacture a flexibleconnector 100 having the desired structures and properties for aparticular use environment of the present invention.

As shown schematically by dicing saw 538 in FIG. 5F, an elongated,mass-produced chain of flexible connector 100 units may be diced orsingulated via etching, other chemical techniques, mechanicaltechniques, or in any other desired manner, into usable-lengthindividual finished flexible connectors 100, by cutting a very long(into and out of the plane of the page in FIGS. 5A-5F) chain intostrips. Each of the individual finished flexible connectors 100 may be,for example, in the range of 5-50 millimeters, and, more specifically,in the range of 10-30 millimeters, deep, again, into and out of theplane of the page, in these Figures.

Each of the finished flexible connectors 100 may include facilitation ofrelative angular motion of the first and second board-facing areas 104with the connector bridge 110. In this manner, first and second mutuallyangularly arranged circuit boards 218 and 220 may be electricallyconnected with a flexible connector 100 including the connector block102 at least partially formed via the sequence of FIGS. 5A-5F. Namely,the first connector ports 112 on the first board-facing area 104 can bebrought into electrical connection with appropriately located pads 222on the first circuit board 218, and the second connector ports 114 onthe second board-facing area 106 can be brought into electricalconnection with corresponding pads 222 on the second circuit board 220.Through the connector traces 116 connecting corresponding first andsecond connector ports 112 and 114, selected pairs of pads 222 on thefirst and second circuit boards 218 and 222 can therefore be in directelectrical contact while the first and second circuit boards 218 and 220are mutually arranged at the operative angle α.

Turning to FIGS. 6-9C, an orientation scheme for locating a flexibleconnector 100 as desired in relation to first and second circuit boards218 and 220, is shown. At least one connector orientation feature 640 isprovided to the connector block 102, optionally, as shown, in at leastone of the first and second board-facing areas 104 and 106. For example,and as shown in the Figures, the connector orientation features 640 canbe full-depth (as shown in FIG. 7A) or blind (as shown in FIG. 7B) holesinto/through the block body 108. As shown in FIG. 8, the connectororientation features 640 are configured for selectively engagingcorresponding board orientation features 842 on a corresponding first orsecond circuit board 218 or 220.

The board orientation features 842 are depicted herein as pegs, in partto engage with the aperture type connector orientation features 640 in amale-to-female manner. However, it is contemplated that the boardorientation features could be apertures for engaging with peg-typeconnector orientation features (neither shown) in a female-to-malemanner. It is also contemplated that certain of the board orientationfeatures could be apertures, and certain others could be pegs, withcorresponding connector orientation features provided, as desired for aparticular implementation of the flexible connector 100. While roundpegs and apertures are shown for simplicity, it is contemplated that thepegs and apertures, or any other orientation feature structures, couldhave any suitable shape, configuration, number, placement, and/or matingor engaging features, as desired for a particular use environment.Optionally, one or both of the orientation feature structures could bethreaded or otherwise configured to facilitate engagement andmaintenance of the flexible connector 100 with the circuit boards 218and 220.

As shown in FIG. 8, the flexible connector 100 can be therefore guidedinto engagement, and the engagement optionally at least partiallyeffectuated, through use of the connector and board orientation feature640 and 842. This sequence of selectively engaging a board orientationfeature 842 on a circuit board 218 or 220 with a corresponding connectororientation feature 640 on the flexible connector 100, in the course ofelectrically connecting first and second mutually angularly arrangedcircuit boards 218 and 220 with a flexible connector 110 including theconnector block 120 is depicted in FIGS. 9A-9C.

In FIG. 9A, the flexible connector 100 is shown as being aligned asdesired with respect to the circuit board 218 or 220 with the connectororientation features 640 poised for engagement with the boardorientation features 842. In FIG. 9B, the flexible connector 100 hasbeen lowered toward the circuit board 218 or 222 insert the boardorientation features 842 into the connector orientation feature 640.Also as shown in FIG. 9B, the first or second connector ports 112 or 114have been brought into electrical contact with the pads 222. Finally, inFIG. 9C, one or both of the connector and board orientation features 640and 842 has been heated to engage and optionally draw down the flexibleconnector 100 into desired contact with the pads 222 of the first andsecond circuit boards 218 and 220, particularly if a thermal coefficientof expansion mismatch technique is used.

Regardless of whether or not connector and board orientation feature 640and 842 are provided to the system, it is contemplated that the flexibleconnector 100 could be removed from the first and second circuit boards218 and 220 by simply reversing the above-described sequence ofinstallation.

It is also contemplated that the silicon wafer or other raw materialcould be completely removed (e.g., to a zero-thickness) at the connectorbridge 110 to provide a connector bridge made from a different materialthan the first and second board-facing areas 104 and 106

While aspects of this disclosure have been particularly shown anddescribed with reference to the example embodiments above, it will beunderstood by those of ordinary skill in the art that various additionalembodiments may be contemplated. For example, the specific methodsdescribed above for using the apparatus are merely illustrative; one ofordinary skill in the art could readily determine any number of tools,sequences of steps, or other means/options for placing theabove-described apparatus, or components thereof, into positionssubstantively similar to those shown and described herein. Any of thedescribed structures and components could be integrally formed as asingle unitary or monolithic piece or made up of separatesub-components, with either of these formations involving any suitablestock or bespoke components and/or any suitable material or combinationsof materials. Any of the described structures and components could bedisposable or reusable as desired for a particular use environment. Anycomponent could be provided with a user-perceptible marking to indicatea material, configuration, at least one dimension, or the likepertaining to that component, the user-perceptible marking aiding a userin selecting one component from an array of similar components for aparticular use environment. A “predetermined” status may be determinedat any time before the structures being manipulated actually reach thatstatus, the “predetermination” being made as late as immediately beforethe structure achieves the predetermined status. Certain structures andcomponents are schematically depicted in the Figures as being slightlyseparated from one another, for clarity of depiction, but one ofordinary skill in the art will understand the contacting relationshipsbetween these structures, based at least upon context and thecorresponding written description. In an effort to maintain clarity inthe Figures, certain ones of duplicative components shown have not beenspecifically numbered, but one of ordinary skill in the art willrealize, based upon the components that were numbered, the elementnumbers which should be associated with the unnumbered components; nodifferentiation between similar components is intended or implied solelyby the presence or absence of an element number in the Figures. Thoughcertain components described herein are shown as having specificgeometric shapes, all structures of this disclosure may have anysuitable shapes, sizes, configurations, relative relationships,cross-sectional areas, or any other physical characteristics asdesirable for a particular application. Any structures or featuresdescribed with reference to one embodiment or configuration could beprovided, singly or in combination with other structures or features, toany other embodiment or configuration, as it would be impractical todescribe each of the embodiments and configurations discussed herein ashaving all of the options discussed with respect to all of the otherembodiments and configurations. A device or method incorporating any ofthese features should be understood to fall under the scope of thisdisclosure as determined based upon the claims below and any equivalentsthereof.

Other aspects, objects, and advantages can be obtained from a study ofthe drawings, the disclosure, and the appended claims.

I claim:
 1. A flexible connector, comprising: a unitary connector blockhaving first and second board-facing areas, the first and secondboard-facing areas being longitudinally spaced from each other on achosen surface of the connector block, the connector block including ablock body transversely separating the chosen surface from an opposingsurface oppositely facing from the chosen surface, and the connectorblock including a flexible connector bridge longitudinally interposedbetween the first and second board-facing areas; a first connector portlocated within the first board-facing area; a second connector portlocated within the second board-facing area; and a connector traceextending through at least a portion of the block body between the firstand second board-facing areas, the connector trace electricallyconnecting the first and second connector ports.
 2. The flexibleconnector of claim 1, wherein the connector bridge and the first andsecond board-facing areas are all made from the same material.
 3. Theflexible connector of claim 1, wherein the connector bridge is made froma different material from the first and second board-facing areas. 4.The flexible connector of claim 2, wherein the connector bridge and thefirst and second board-facing areas are concurrently and unitarilyformed as a monolithic component of the connector block.
 5. The flexibleconnector of claim 1, wherein a selected one of the chosen surface andthe opposing surface of the connector block is contoured at differingdistances from the other one of the chosen surface and the opposingsurface along a longitudinal dimension of the connector block.
 6. Theflexible connector of claim 1, wherein the connector block has a firsttransverse thickness at at least one of the first and secondboard-facing areas and a second transverse thickness at the connectorbridge, and the second transverse thickness is a minority of the firsttransverse thickness.
 7. The flexible connector of claim 1, wherein thechosen surface faces first and second circuit boards for creating anelectrical connection therebetween, and the block body is interposedbetween the chosen surface and the opposing surface.
 8. The flexibleconnector of claim 1, wherein the block body includes at least oneincreased-thickness portion and at least one reduced-thickness portion,and each connector trace includes at least one via extendingtransversely through an increased-thickness portion of the block body.9. The flexible connector of claim 1, including at least one connectororientation feature for selectively engaging a corresponding boardorientation feature on a circuit board.
 10. The flexible connector ofclaim 1, wherein the block body includes a plurality of laminatedsubstrate layers, with a selected substrate layer forming the chosensurface having a significantly varied transverse thickness along alongitudinal dimension thereof.
 11. A method comprising: providing aplanar chosen substrate having transversely spaced top and bottom chosensubstrate surfaces; defining first and second board-facing areaslongitudinally spaced from each other on a selected one of the top andbottom chosen substrate surfaces; providing a planar opposing substratehaving transversely spaced top and bottom opposing substrate surfaces;attaching the chosen and opposing substrates together to at leastpartially form a unitary connector block including a block body with thefirst and second board-facing areas on an outward-facing surfacethereof; depositing a conductive material to generate a first connectorport located within the first board-facing area; depositing a conductivematerial to generate a second connector port located within the secondboard-facing area; depositing a conductive material on at least one ofthe chosen and opposing substrate surfaces to generate a connector traceextending through at least a portion of the block body between the firstand second board-facing areas; electrically connecting the first andsecond connector ports with the connector trace; and selectivelyreducing a thickness of one of the chosen and opposing substratesurfaces to define a flexible connector bridge longitudinally interposedbetween the first and second board-facing areas; facilitating relativeangular motion of the first and second board-facing areas with theconnector bridge.
 12. The method of claim 11, wherein selectivelyreducing a thickness of one of the chosen and opposing substratesurfaces to define a flexible connector bridge longitudinally interposedbetween the first and second board-facing areas includes selectivelyreducing a thickness of the selected one of the chosen and opposingsubstrate surfaces upon which the first and second board-facing areasare defined.
 13. The method of claim 11, wherein selectively reducing athickness of one of the chosen and opposing substrate surfaces to definea flexible connector bridge longitudinally interposed between the firstand second board-facing areas includes selectively reducing a thicknessof the other one of the chosen and opposing substrate surfaces uponwhich the first and second board-facing areas are defined.
 14. Themethod of claim 11, wherein depositing a conductive material on at leastone of the chosen and opposing substrate surfaces to generate aconnector trace includes creating at least one via extendingtransversely through an increased-thickness portion of the block body.15. The method of claim 11, including electrically connecting first andsecond mutually angularly arranged circuit boards with a flexibleconnector including the connector block.
 16. The method of claim 15,wherein electrically connecting first and second mutually angularlyarranged circuit boards with a flexible connector including theconnector block includes selectively engaging a board orientationfeature on a circuit board with a corresponding connector orientationfeature on the flexible connector.
 17. An apparatus for electricallyconnecting pairs of pads on mutually angularly arranged circuit boards,the apparatus comprising: a planar chosen substrate having transverselyspaced top and bottom chosen substrate surfaces, and first and secondboard-facing areas being longitudinally spaced from each other on aselected one of the top and bottom chosen substrate surfaces; a planaropposing substrate having transversely spaced top and bottom opposingsubstrate surfaces, a selected one of the chosen and opposing substrateshaving a significantly varied transverse thickness along a longitudinaldimension thereof; a unitary connector block at least partially formedby the chosen and opposing substrates, the connector block including ablock body; a first connector port located within the first board-facingarea; a second connector port located within the second board-facingarea; a connector trace extending through at least a portion of theblock body between the first and second board-facing areas, theconnector trace electrically connecting the first and second connectorports; and a flexible connector bridge longitudinally interposed betweenthe first and second board-facing areas for facilitating relativeangular motion of the first and second board-facing areas.
 18. Theapparatus of claim 17, wherein the connector bridge and the first andsecond board-facing areas are all made from the same material.
 19. Theapparatus of claim 17, wherein the connector bridge is made from adifferent material from the first and second board-facing areas.
 20. Theapparatus of claim 18, wherein the connector bridge and the first andsecond board-facing areas are concurrently and unitarily formed as amonolithic component of the connector block.
 21. The apparatus of claim17, wherein the connector block has a first transverse thickness at atleast one of the first and second board-facing areas and a secondtransverse thickness at the connector bridge, and the second transversethickness is a minority of the first transverse thickness.
 22. Theapparatus of claim 17, wherein the block body includes at least oneincreased-thickness portion and at least one reduced-thickness portion,and each connector trace includes at least one via extendingtransversely through an increased-thickness portion of the block body.23. The apparatus of claim 17, including at least one connectororientation feature for selectively engaging a corresponding boardorientation feature on a circuit board.